Top feature package and method

ABSTRACT

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present application relates to the field of electronics, and moreparticularly, to methods of forming electronic component packages andrelated structures.

2. Description of the Related Art

A wireless electronic component package is used to send and receiveelectromagnetic radiation, sometimes called wireless signals. An antennais used to propagate the wireless signals from/to the wirelesselectronic component package.

Generally, a discrete antenna, i.e., a separate piece, is mounted toform the wireless electronic component package. However, the antennamounting requires special tooling and additional assembly operationsthus increasing the overall cost of the wireless electronic componentpackage. Further, space must be allocated for the antenna thusrestricting the ability to miniaturize the wireless electronic componentpackage.

SUMMARY OF THE INVENTION

An electronic component package includes a substrate and an electroniccomponent mounted to the substrate, the electronic component including abond pad. A first antenna terminal is electrically connected to the bondpad, the first antenna terminal being electrically connected to a secondantenna terminal of the substrate.

A package body encloses the electronic component, the package bodyhaving a principal surface. An antenna is formed on the principalsurface by applying an electrically conductive coating. An embeddedinterconnect extends through the package body between the substrate andthe principal surface and electrically connects the second antennaterminal to the antenna. Applying an electrically conductive coating toform the antenna is relatively simple thus minimizing the overallpackage manufacturing cost. Further, the antenna is relatively thin thusminimizing the overall package size.

These and other features of the present invention will be more readilyapparent from the detailed description set forth below taken inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a wireless electronic componentpackage in accordance with one embodiment;

FIG. 1A is a cross-sectional view of a wireless electronic componentpackage in accordance with one embodiment;

FIG. 2 is a cross-sectional view of a wireless electronic componentpackage in accordance with another embodiment;

FIG. 3 is a top perspective view of the wireless electronic componentpackage of FIG. 2 during fabrication and prior to formation of a packagebody;

FIG. 4 is a cross-sectional view of a wireless electronic componentpackage in accordance with another embodiment;

FIG. 5 is a perspective view of the wireless electronic componentpackage of FIG. 4 in accordance with one embodiment;

FIG. 6 is a perspective view of the wireless electronic componentpackage of FIG. 4 in accordance with another embodiment;

FIG. 7 is a cross-sectional view of a wireless electronic componentpackage in accordance with yet another embodiment;

FIG. 8 is a cross-sectional view of an electronic component package inaccordance with one embodiment;

FIG. 9 is a top plan view of the electronic component package of FIG. 8along the line IX illustrating a top feature in accordance with oneembodiment;

FIGS. 10, 11, 12, 13 and 14 are enlarged cross-sectional views of theregion X of the electronic component package of FIG. 8 during variousstages of formation of an electrical connection of an embeddedinterconnect to the top feature in accordance with various embodiments;

FIG. 15 is an enlarged cross-sectional view of a region of an electroniccomponent package illustrating an electrical connection of an embeddedinterconnect to a top feature of a second conformal top feature layer inaccordance with one embodiment; and

FIG. 16 is a cross-sectional view of an electronic component package inaccordance with another embodiment.

In the following description, the same or similar elements are labeledwith the same or similar reference numbers.

DETAILED DESCRIPTION

FIG. 1 is a cross-sectional view of a wireless electronic componentpackage 100 in accordance with one embodiment. Wireless electroniccomponent package 100, sometimes called an electronic component package,includes a substrate 102. Substrate 102 is a dielectric material such aslaminate, ceramic, printed circuit board material, or other dielectricmaterial.

Substrate 102 includes an upper, e.g., first, surface 102U and anopposite lower, e.g., second, surface 102L. Substrate 102 furtherincludes sides 102S extending perpendicularly between upper surface 102Uand lower surface 102L. Although the terms parallel, perpendicular, andsimilar terms are used herein, it is to be understood that the describedfeatures may not be exactly parallel and perpendicular, but onlysubstantially parallel and perpendicular to within acceptedmanufacturing tolerances.

Wireless electronic component package 100 further includes an electroniccomponent 104, e.g., a single die. In one embodiment, electroniccomponent 104 is an integrated circuit chip, e.g., an active component.Electronic component 104, sometimes called a transceiver (Xcvr) chip, iscapable of generating and/or receiving electromagnetic signals, e.g.,radio frequency (RF) signals, in one embodiment. However, in otherembodiments, electronic component 104 is a passive component such as acapacitor, resistor, or inductor. Further, in one embodiment, electroniccomponent 104 includes two or more stacked dies.

In accordance with this embodiment, electronic component 104 is a singledie and includes an active surface 106, an opposite inactive surface108, and sides 110 extending perpendicularly between active surface 106and inactive surface 108.

Electronic component 104 further includes bond pads 112 formed on activesurface 106. Inactive surface 108 is mounted to upper surface 102U ofsubstrate 102 with an adhesive 114.

Formed on upper surface 102U of substrate 102 are one or moreelectrically conductive upper, e.g., first, traces 116, e.g., formed ofcopper. One or more of bond pads 112 are electrically connected to oneor more respective upper traces 116, e.g., bond fingers thereof, by oneor more respective electrically conductive bond wires 118.

Although a bond pad configuration for electronic component 104 is setforth, in another embodiment, electronic component 104 is mounted in aflip chip configuration. In accordance with this embodiment, bond pads112 are electrically and physically connected to upper traces 116 and toan antenna terminal 128 as discussed below by flip chip bumps, e.g.,solder bumps, extending between bond pads 112 and upper traces116/antenna terminal 128.

Formed on lower surface 102L of substrate 102 are lower, e.g., second,traces 120. Lower traces 120 are electrically connected to upper traces116 by electrically conductive vias 122 extending through substrate 102between upper surface 102U and lower surface 102L.

Although not illustrated in FIG. 1, in one embodiment, wirelesselectronic component package 100 further includes solder masks on upperand lower surface 102U, 102L that protect first portions of upper andlower traces 116, 120 while exposing second portions, e.g., terminalsand/or bond fingers, of upper and lower traces 116, 120.

Formed on lower traces 120 are electrically conductive interconnectionpads 124. Formed on interconnection pads 124 are electrically conductiveinterconnection balls 126, e.g., solder balls in a ball grid array(BGA). In another embodiment, interconnection balls 126 are not formed,e.g., to form a land grid array (LGA). Although BGA and LGA packageconfigurations are set forth, in other embodiments, wireless electroniccomponent package 100 is formed with other package configurations.

Although a particular electrically conductive pathway between bond pads112 and interconnection balls 126 is described above, other electricallyconductive pathways can be formed. For example, contact metallizationscan be formed between the various electrical conductors.

Further, instead of straight though vias 122, in one embodiment,substrate 102 is a multilayer substrate and a plurality of vias and/orinternal traces form the electrical interconnection between upper traces116 and lower traces 120.

Wireless electronic component package 100 further includes electricallyconductive antenna terminals 128, 130, sometimes called first and secondantenna terminals. Antenna terminals 128, 130 are formed on uppersurface 102U of substrate 102.

Antenna terminals 128, 130 are electrically connected to an internalantenna trace 132 by electrically conductive antenna vias 134, 136,respectively. Internal antenna trace 132 is formed within (internal to)substrate 102 and between, but separated from, upper surface 102U andlower surface 102L. In other embodiments, antenna trace 132 is formed onupper surface 102U or lower surface 102L of substrate 102.

Antenna terminal 128 is electrically connected by antenna via 134,sometimes called a first antenna via, to a first end of internal antennatrace 132. Similarly, antenna terminal 130 is electrically connected byantenna via 136, sometimes called a second antenna via, to a second endof internal antenna trace 132. A respective bond pad 112 is electricallyconnected to first antenna terminal 128 by a respective bond wire 118.

Wireless electronic component package 100 further includes a dielectricpackage body 138, e.g., formed of encapsulant or molding compound.Package body 138 encloses upper surface 102U of substrate 102,electronic component 104, and bond wires 118.

Package body 138 includes sides 138S and a principal surface 138P.Principal surface 138P is parallel to upper and lower surfaces 102U,102L of substrate 102, and active and inactive surfaces 106, 108 ofelectronic component 104. Principal surface 138P is spaced aboveelectronic component 104 and bond wires 118.

Sides 138S of package body 138 are parallel to and coplanar with sides102S of substrate in accordance with this embodiment. Illustratively,wireless electronic component package 100 is formed simultaneously witha plurality of wireless electronic component packages 100 in an array.The array is singulated, e.g., by sawing or laser, resulting in sides102S of substrate 102 being parallel to and coplanar with sides 1385 ofpackage body 138. However, wireless electronic component package 100 isformed individually in another embodiment.

In yet another embodiment, sides 138S of package body 138 are locatedinwards of sides 1025 of substrate 102. In accordance with thisembodiment, the periphery of upper surface 102U of substrate 102 isexposed and not covered by package body 138. Further, sides 138S can beangled, i.e., not perpendicular to upper surface 102U.

An electrically conductive embedded interconnect 140 extends throughpackage body 138 between antenna terminal 130 and principal surface 138Pof package body 138. Embedded interconnect 140 is electrically connectedto antenna terminal 130 at a lower, e.g., first, surface 140L ofembedded interconnect 140. An upper, e.g., second, surface 140U ofembedded interconnect 140 is parallel to and coplanar with principalsurface 138P in accordance with this embodiment. However, in otherembodiments, upper surface 140U protrudes above or is recessed belowprincipal surface 138P. Further, instead of being planar (flat) as inthe view of FIG. 1, in other embodiments, upper surface 140U isnon-planar, e.g., is curved in the concave or convex direction.

Formed on principal surface 138P of package body 138 is an electricallyconductive antenna 142. Antenna 142 is electrically connected toembedded interconnect 140, e.g., to upper surface 140U. Generally,embedded interconnect 140 forms an interconnection through package body138 and between antenna terminal 130 and antenna 142.

Accordingly, electromagnetic signals, e.g., RF signals, generated byelectronic component 104 are propagated from bond pad 112, to bond wire118, to antenna terminal 128, to antenna via 134, to internal antennatrace 132, to antenna via 136, to antenna terminal 130, to embeddedinterconnect 140, and to antenna 142. The electromagnetic signalemanates from antenna 142 as electromagnetic radiation, sometimes calleda wireless signal.

To fabricate wireless electronic component package 100, in oneembodiment, substrate 102 is fabricated and includes upper traces 116,lower traces 120, vias 122, pads 124, interconnection balls 126(alternatively interconnection balls 126 can be fabricated at laterstages of fabrication), antenna terminals 128, 130, internal antennatrace 132, and antenna vias 134, 136. Inactive surface 108 of electroniccomponent 104 is mounted to upper surface 102U of substrate 102 withadhesive 114. Bond wires 118 are formed to electrically connect bondpads 112 to upper traces 116, e.g., bond fingers thereof, and to antennaterminal 128.

Package body 138 is formed to encapsulate upper surface 102U ofsubstrate 102, electronic component 104, and bond wires 118.Illustratively, package body 138 is formed using a molding system inwhich wireless electronic component package 100 (absent package body138) is placed into a mold. Mold compound is injected into the mold andthen cured, e.g., cooled, to form package body 138. Wireless electroniccomponent package 100 is removed from the mold. Any one of a number ofdifferent molding systems can be used to form package body 138 and theparticular molding system used is not essential to this embodiment.

In one embodiment, to form embedded interconnect 140, a via aperture 144is formed in package body 138. Via aperture 144 extends betweenprincipal surface 138P and antenna terminal 130 such that antennaterminal 130 is exposed through via aperture 144. Illustratively, viaaperture 144 is formed using a laser-ablation process where a laserablates, i.e., removes, a portion of package body 138 thus forming viaaperture 144 although can be formed using other via aperture formationtechniques. Via aperture 144 is filled with an electrically conductivematerial, e.g., by plating, thus forming embedded interconnect 140.Although not illustrated, embedded interconnect 140 tapers due to thelaser-ablation process in one embodiment, e.g., the diameter at uppersurface 140U is greater than the diameter at lower surface 140L.

For example, via aperture 144 and embedded interconnect 140 are formedusing a method similar to that set forth in Yoshida et al., U.S. patentapplication Ser. No. 12/474,009, entitled “STACKABLE PROTRUDING VIAPACKAGE AND METHOD”, filed on May 28, 2009, which is herein incorporatedby reference in its entirety.

In another embodiment, prior to formation of package body 138, embeddedinterconnect 140 is formed on antenna terminal 130. For example,embedded interconnect 140 is a wire fence, e.g., a fence formed fromwire, or just a single wire. Package body 138 is formed around andencloses embedded interconnect 140 in accordance with this embodiment.Embedded interconnect 140 is exposed at principal surface 138P.

For example, embedded interconnect 140 is formed using a method similarto that set forth in Scanlan et al., U.S. patent application Ser. No.11/754,209, entitled “A SEMICONDUCTOR DEVICE HAVING EMI SHIELDING ANDMETHOD THEREFOR”, filed on May 25, 2007, now U.S. Pat. No. 7,898,066,issued Mar. 1, 2011, which is herein incorporated by reference in itsentirety.

In yet another embodiment, to form embedded interconnect 140, aninterconnection ball, e.g., a pre-attached solderball and/ornon-collapsing interconnection ball, is formed on antenna terminal 130prior to formation of package body 138. Package body 138 is formedaround and encloses the interconnection ball.

In one embodiment, the interconnection ball is exposed at principalsurface 138P of package body 138 and thus forms embedded interconnect140. In another example, a via aperture is made in package body 138 toexpose the interconnection ball, i.e., extending between principalsurface 138P and the interconnection ball. The via aperture is filledwith an electrically conductive via filling material such that theinterconnection ball and the via filling material collective formembedded interconnect 140.

For example, embedded interconnect 140 is formed using a method similarto that set forth in Yoshida et al., U.S. patent application Ser. No.12/483,913, entitled “STACKABLE VIA PACKAGE AND METHOD”, filed on Jun.12, 2009, which is herein incorporated by reference in its entirety.

In yet another embodiment, embedded interconnect 140 is a stack ofinterconnection balls, e.g., a stack of solderballs and/ornon-collapsing interconnection balls, formed on antenna terminal 130prior to formation of package body 138. Package body 138 is formedaround and encloses the stack of interconnection balls. The stack ofinterconnection balls is exposed at principal surface 138P of packagebody 138 to form embedded interconnection 140.

In yet another embodiment, package body 138 is formed. A via aperture isformed in package body 138 to extend between principal surface 138P andantenna terminal 130 such that antenna terminal 130 is exposed throughthe via aperture. Illustratively, the via aperture is formed using alaser-ablation process although can be formed using other via apertureformation techniques, e.g., mechanical drilling. The via aperture isfilled with a stack of interconnection balls thus forming embeddedinterconnect 140.

For example, embedded interconnect 140 is formed using a method similarto that set forth in Darveaux et al., U.S. patent application Ser. No.12/692,397, entitled “FLEX CIRCUIT PACKAGE AND METHOD”, filed on Jan.22, 2010, which is herein incorporated by reference in its entirety.

Generally, embedded interconnect 140 is formed using any one of themethods described above including: (1) forming a via aperture in packagebody 138, e.g., using laser-ablation and filling the via aperture; (2)forming a wire fence and enclosing the wire fence in package body 138;(3) forming an interconnection ball and enclosing the interconnectionball in package body 138 such that the interconnection ball is exposedfrom package body 138; (4) forming an interconnection ball, totallyenclosing the interconnection ball in package body 138, forming a viaaperture in package body 138 to expose the interconnection ball, andfilling the via aperture; (5) forming a stack of interconnection ballsand enclosing the stack within package body 138; and (6) forming a viaaperture in package body 138, e.g., using laser-ablation, and fillingthe via aperture with a stack of interconnection balls.

After fabrication of embedded interconnect 140 using any of thetechniques as set forth above, antenna 142 is formed. In one embodiment,an electrically conductive material is selectively applied to principalsurface 138P to form antenna 142. Illustratively, an electricallyconductive coating, e.g., electrically conductive paint such as aurethane base silver paint, is selectively sprayed and cured, e.g.,dried, to form antenna 142. In another embodiment, an electricallyconductive coating is non-selectively applied to package body 138 andpatterned, e.g., using laser-ablation, to form antenna 142. Antenna 142can be patterned into any one of a number of shapes, e.g., an F shape, arectangle, two rows of interconnected rectangles, with three rectanglesper row, or other shape.

Applying an electrically conductive coating to form antenna 142 isrelatively simple compared to mounting a discrete antenna. Accordingly,the tooling and assembly operations required to form antenna 142 areminimized thus minimizing the overall fabrication cost of wirelesselectronic component package 100. Further, antenna 142 is relativelythin, e.g., has a thickness equal to a layer of conductive paint, thusminimizing the overall size of wireless electronic component package100.

FIG. 1A is a cross-sectional view of a wireless electronic componentpackage 100A in accordance with one embodiment. Wireless electroniccomponent package 100A of FIG. 1A is substantially similar to wirelesselectronic component package 100 of FIG. 1 and only the significantdifferences between wireless electronic component package 100A andwireless electronic component package 100 are discussed below.

Referring now to FIG. 1A, in accordance with this embodiment, wirelesselectronic component package 100A includes a matching component 146. Inone embodiment, matching component 146 matches the signals, e.g., RFsignals, from electronic component 104 to the impedance of antenna 142to control the wireless signal transmitted from antenna 142, althoughmatching component 146 performs other functions in other embodiments.

Matching component 146 includes a single electronic component, e.g., anactive or passive component, in one embodiment. In another embodiment,matching component 146 includes two or more electronic components, e.g.,two or more active and/or passive components, for example, is an LC(inductor-capacitor) matching component.

Generally, matching component 146 is electrically connected betweenelectronic component 104 and antenna terminal 130. In this specificexample, matching component 146 includes contacts 148 electricallyconnected to matching component terminals 150 on upper surface 102U bysolder joints 152. Matching component terminals 150 are electricallyconnected to internal traces 132A, 132B by matching component vias 154.Internal traces 132A, 132B are electrically connected to antenna vias134, 136, respectively.

Although a surface mounting configuration for matching component 146 isillustrated and discussed, in other embodiments, matching component 146is mounted in a flip chip, wire bond, or other configuration. Further,although a particular interconnection including contacts 148, terminals150, solder joints 152, vias 154, traces 132A, 132B are illustrated, theinterconnection is an example only, and other interconnections can beformed depending upon the particular application.

FIG. 2 is a cross-sectional view of a wireless electronic componentpackage 200 in accordance with another embodiment. Wireless electroniccomponent package 200 of FIG. 2 is substantially similar to wirelesselectronic component package 100 of FIG. 1 and only the significantdifferences between wireless electronic component package 200 andwireless electronic component package 100 are discussed below.

Referring now to FIG. 2, in accordance with this embodiment, wirelesselectronic component package 200 includes an electrically conductiveshielding structure 246. Shielding structure 246 shields electroniccomponent 104 and other passive or active electronic components ofwireless electronic component package 200, e.g., a matching component,from electromagnetic radiation, e.g., from antenna 142, and generallyshields electronic component 104 from electromagnetic interference(EMI).

FIG. 3 is a top perspective view of wireless electronic componentpackage 200 of FIG. 2 during fabrication and prior to formation ofpackage body 138. Referring now to FIGS. 2 and 3 together, shieldingstructure 246 includes a shield lid 248, shield lid sidewalls 250, andan embedded shield lid interconnect 252. Shield lid 248 is formeddirectly on and covers the portion of principal surface 138P of packagebody 138 directly above electronic component 104. Shield lid 248 extendsfrom sides 138S of package body 138 to embedded shield lid interconnect252.

Shield lid sidewalls 250 are electrically connected to shield lid 248.Shield lid sidewalls 250 are formed directly on and cover the portionsof sides 138S of package body 138 adjacent electronic component 104. Inone embodiment, as illustrated in FIG. 2, shield lid sidewalls 250 arefurther formed directly on and extend to cover the portions of sides102S of substrate 102 adjacent electronic component 104.

In one embodiment, shield lid 248 and shield lid sidewalls 250 areformed of an electrically conductive material applied to principalsurface 138P and sides 138S of package body 138. Illustratively, anelectrically conductive coating, e.g., electrically conductive paint, isselectively sprayed and cured, e.g., dried, to form shield lid 248 andshield lid sidewalls 250. In another embodiment, an electricallyconductive coating is non-selectively applied to package body 138 andpatterned, e.g., using laser-ablation, to form shield lid 248 and shieldlid sidewalls 250.

In one embodiment, shield lid 248 and shield lid sidewalls 250 areformed simultaneously with antenna 142. In this manner, manufacturing issimplified thus reducing the overall fabrication cost of wirelesselectronic component package 200. However, in another embodiment, shieldlid 248 and shield lid sidewalls 250 are formed before, or after,antenna 142.

Shield lid interconnect 252 extends from a shield trace 254 to shieldlid 248 through package body 138. In one embodiment, shield lidinterconnect 252 is a wire fence extending lengthwise from one side102S1 to the opposite side 10252 of sides 102S of substrate 102.

Illustratively, shield trace 254 extends on upper surface 102U ofsubstrate 102 between sides 102S1, 102S2, although can be formed of asmaller trace or a plurality of smaller traces. Shield lid interconnect252 is formed of one or more wires 256 formed on shield trace 254, wires256 forming a wire fence. The spacing between wires 256 is sufficientlysmall to prevent electromagnetic radiation from passing between wires256 as discussed further below.

Although a particular configuration for wires 256 and shield trace 254is illustrated in FIGS. 2 and 3, in light of this disclosure, those ofskill in the art will understand that the configurations areillustrative, and other configurations are possible. Generally, seeScanlan et al., U.S. patent application Ser. No. 11/754,209, cited aboveregarding the formation and configuration of wire fences.

Shield trace 254 is electrically connected to a respectiveinterconnection ball 126 by a respective via 122, lower trace 120, andinterconnection pad 124. In one embodiment, shield trace 254 and thusshielding structure 246 is electrically connected to a reference voltagesource, e.g., ground.

Although a single interconnect to shielding structure 246 through shieldtrace 254 is illustrate, in other examples, additional interconnects toshielding structure 246 are possible. For example, a shield trace can beformed on upper surface 102U at side 102S and to the left of upper trace116 in the view of FIG. 2 and electrically connected to shieldingstructure 246. In another example, a ground trace of substrate 102 canbe exposed at side 102S of substrate 102 and connected to shieldingstructure 246.

Accordingly, shielding structure 246 defines a shielded compartment 258in which electronic component 104 is located. By locating electroniccomponent 104 within shielded compartment 258, electronic component 104is shielded from electromagnetic radiation emanating from antenna 142,also referred to herein as EMI from antenna 142, by shielding structure246.

Specifically, shield lid interconnect 252 prevents EMI from passingsideways through package body 138 and to electronic component 104.Shield lid 248 prevents EMI from passing through principal surface 138Pof package body 138 and to electronic component 104. Further, shield lidsidewalls 250 prevent EMI from passing through sides 138S of packagebody 138 and to electronic component 104. In one embodiment, a groundplane is formed in substrate 102, e.g., on an interlayer conductiveplane of substrate 102, thus shielding electronic component 102 from EMIpassing through substrate 102.

Further, by locating electronic component 104 within shieldedcompartment 258, antenna 142 is shielded from EMI emanating fromelectronic component 104 for reasons similar to those set forth above.

FIG. 4 is a cross-sectional view of a wireless electronic componentpackage 400 in accordance with another embodiment. FIG. 5 is aperspective view of wireless electronic component package 400 of FIG. 4in accordance with one embodiment. In FIG. 5, the outlines of substrate102, package body 138, and a shield lid interconnect 452 are illustratedin dashed lines for clarity of presentation.

Wireless electronic component package 400 of FIGS. 4, 5 is substantiallysimilar to wireless electronic component package 200 of FIG. 2 and onlythe significant differences between wireless electronic componentpackage 400 and wireless electronic component package 200 are discussedbelow. More particularly, wireless electronic component package 400 isformed with shield lid interconnect 452 as described below whereaswireless electronic component package 200 is formed with shield lidinterconnect 252 as described above.

Referring now to FIGS. 4 and 5 together, in accordance with thisembodiment, shielding structure 246 includes shield lid 248, shield lidsidewalls 250, and embedded shield lid interconnect 452.

Shield lid interconnect 452 extends from shield trace 254 to shield lid248 through package body 138. In one embodiment, shield lid interconnect452 is conductive wall extending lengthwise from one side 102S1 to theopposite side 102S2 of substrate 102 in a manner similar to thatdescribed above regarding shield lid interconnect 252 and illustrated inFIG. 3.

Shield lid interconnect 452 includes sides 452S parallel to and coplanarwith sides 138S of package body 138. Further, shield lid interconnect452 includes a top 452T parallel to and coplanar with principal surface138P of package body 138. Generally, sides 452S and top 452T of shieldlid interconnect 452 are exposed from package body 138 and, in oneembodiment, covered by shield lid 248 and shield lid sidewalls 250.Shield lid interconnect 452 further includes a bottom 452B on uppersurface 102U of substrate 102, and more particularly, on shield trace254.

Shield lid 248 covers top 452T of shield lid interconnect 452 and theentire portion of principal surface 138P to the left of shield lidinterconnect 452 in the view of FIGS. 4, 5. Further, shield lidsidewalls 250 cover sides 452S of shield lid interconnect 452 and theportion of sides 102S1, 102S2 directly below sides 452S. Further, shieldlid sidewalls 250 cover the portions of sides 138S, 102S1, 102S2 to theleft of sides 452S including completely covering the sides 138S, 1025 atthe left in the view of FIGS. 4, 5.

Wireless electronic component package 400 is fabricated in a mannersimilar to that set forth above regarding wireless electronic componentpackage 200 and only the significant differences in the fabricationmethod are set forth below. More particularly, after fabrication ofpackage body 138, a trench is formed, e.g., using laser-ablation, inpackage body 138 to expose shield trace 254. This trench is filled withan electrically conductive filler material to form shield lidinterconnect 452.

In one embodiment, shield lid interconnect 452 tapers due to thelaser-ablation process, i.e., the area of top 452T is greater than thearea of bottom 452B of shield lid interconnect 452. In accordance withthis embodiment, shield lid interconnect 452 prevents EMI from passingsideways through package body 138 and to/from electronic component 104.

FIG. 6 is a perspective view of wireless electronic component package400 of FIG. 4 in accordance with another embodiment. In FIG. 6, theoutlines of substrate 102, package body 138, and shield lid interconnect452 are illustrated in dashed lines for clarity of presentation.

Referring now to FIGS. 4 and 6 together, in accordance with thisembodiment, shield lid interconnect 452 includes a plurality ofconductive vias 660 arranged in a side-by-side configuration to extendlengthwise from one side 102S1 to the opposite side 102S2 of substrate102 in a manner similar to that described above regarding shield lidinterconnect 252 as illustrated in FIG. 3.

Wireless electronic component package 400 is fabricated in a mannersimilar to that set forth above regarding wireless electronic componentpackage 200 and only the significant differences in the fabricationmethod are set forth below. More particularly, after fabrication ofpackage body 138, a plurality of via apertures are formed, e.g., usinglaser-ablation, in package body 138 to expose portions of shield trace254. These via apertures are filled with an electrically conductivefiller material to form vias 660, i.e., to form shield lid interconnect452. In one embodiment, vias 660 taper due to the laser-ablationprocess, i.e., the diameter of vias 660 at principal surface 138P isgreater than the diameter of vias 660 at upper surface 102U.

The spacing between vias 660 is sufficiently small to preventelectromagnetic radiation from passing between vias 660. In accordancewith this embodiment, shield lid interconnect 452 prevents EMI frompassing sideways through package body 138 and to/from electroniccomponent 104.

Although various examples are set forth above of forming a shield lidinterconnect, e.g., shield lid interconnect 252 of FIGS. 2, 3 and shieldlid interconnect 452 of FIGS. 4, 5, 6, these examples are illustrativeonly and other shield lid interconnects are formed in other embodiments.Generally, a shield lid interconnect: (1) provides the electricalconnection to shield lid 248 and shield lid sidewalls 250 throughpackage body 138; and/or (2) prevents EMI from passing sideways throughpackage body 138 to/from electronic component 104.

Further, a shield lid interconnect is formed using any one of themethods described above and including: (1) forming a wire fence andenclosing the wire fence in package body 138; (2) forming a trench inpackage body 138, e.g., using laser-ablation, and filling the trench;(3) forming one or more via apertures in package body 138, e.g., usinglaser-ablation and filling the via apertures; (4) forming one or moreinterconnection balls and enclosing the interconnection balls in packagebody 138 such that the interconnection balls are exposed from packagebody 138; (5) forming one or more interconnection balls, totallyenclosing the interconnection balls in package body 138, forming viaapertures in package body 138 to expose the interconnection balls, andfilling the via apertures; (6) forming one or more stacks ofinterconnection balls and enclosing the stacks within package body 138;and (7) forming one or more via apertures in package body 138, e.g.,using laser-ablation, and filling the via apertures with stacks ofinterconnection balls.

FIG. 7 is a cross-sectional view of a wireless electronic componentpackage 700 in accordance with yet another embodiment. Wirelesselectronic component package 700 of FIG. 7 is substantially similar towireless electronic component package 200 of FIG. 2 and only thesignificant differences between wireless electronic component package700 and wireless electronic component package 200 are discussed below.More particularly, wireless electronic component package 700 is formedwith an embedded shielding structure 762 as described below whereaswireless electronic component package 200 is formed with shieldingstructure 246 as described above.

Referring now to FIG. 7, in accordance with this embodiment, embeddedshielding structure 762 is an electrically conductive enclosure, forexample, a metal can. Shielding structure 762 includes a shield lid 764and shield lid sidewalls 766. Shield lid 764 is parallel to and locateddirectly above active surface 106 of electronic component 104. Shieldlid sidewalls 766 are parallel to and located adjacent to all four sides110 of electronic component 104.

Shield lid sidewalls 766 are electrically connected to shield trace 254.Accordingly, shielding structure 762 defines a shielded compartment 758in which electronic component 104 is located. By locating electroniccomponent 104 within shielded compartment 758, electronic component 104is shielded from EMI from antenna 142 by shielding structure 762.Further, by locating electronic component 104 within shieldedcompartment 758, antenna 142 is shielded from EMI emanating fromelectronic component 104.

Package body 138 encloses shielding structure 762. More particularly,package body 138 encloses and electrically isolates shield lid 764 andshield lid sidewalls 766 from antenna 142. Package body 138 existbetween principal surface 138P and shield lid 764. Further, package body138 exist between sides 138S of package body 138 and shield lidsidewalls 766.

As shielding structure 762 is completing enclosed within package body138, antenna 142 can be formed anywhere upon principal surface 138P ofpackage body 138. In one embodiment, as indicated by the dashed lines inFIG. 7, antenna 142 extends upon principal surface 138P to be locateddirectly above electronic component 104. In this manner, maximumflexibility in the design of antenna 142 is achieved.

In one embodiment, shielding structure 762 has openings formed thereinto allow the material, e.g., mold compound, of package body 138 to fillshielding structure 762. These openings are sufficiently small toprevent EMI from passing through the openings.

In another embodiment, shielding structure 762 does not include openingssuch that package body 138 does not fill shielding structure 762.Illustratively, shielding structure 762 and thus shielded compartment758 contains air.

FIG. 8 is a cross-sectional view of an electronic component package 800in accordance with one embodiment. Electronic component package 800 ofFIG. 8 is similar to wireless electronic component package 100 ofFIG. 1. More particularly, electronic component package 800 includessubstrate 102, upper surface 102U, lower surface 102L, sides 102S,electronic component 104, active surface 106, inactive surface 108,sides 110, bond pads 112, adhesive 114, upper traces 116, bond wires118, lower traces 120, vias 122, pads 124, interconnection balls 126,and package body 138 similar or identical to substrate 102, uppersurface 102U, lower surface 102L, sides 102S, electronic component 104,active surface 106, inactive surface 108, sides 110, bond pads 112,adhesive 114, upper traces 116, bond wires 118, lower traces 120, vias122, pads 124, interconnection balls 126, and package body 138 ofwireless electronic component package 100.

Referring now to FIG. 8, in accordance with this embodiment, substrate102 includes an electrically conductive internal plane 860, e.g., aground plane, hereinafter referred to as ground plane 860 forsimplicity. Ground plane 860 is formed within (internal to) substrate102 and between, but separated from, upper surface 102U and lowersurface 102L. In accordance with this embodiment, ground plane 860 isexposed at sides 102S of substrate 102.

Ground plane 860 is electrically connected to a respectiveinterconnection ball 126 by a via 862, sometimes called a ground via862, a respective lower trace 120 connected to ground via 862, andinterconnection pad 124. In one embodiment, ground plane 860 iselectrically connected to a reference voltage source, e.g., ground,through the respective interconnection ball 126. Although a singleinterconnect to ground plane 860 through ground via 862 is illustrate,in other examples, additional interconnects to ground plane 860 areformed.

Electronic component package 800 further includes a conformal shield864. Conformal shield 864 directly contacts, covers, and enclosesprincipal surface 138P of package body 138, sides 138S of package body138, and sides 102S of substrate 102.

Conformal shield 864 is formed of an electrically conductive material.For example, conformal shield 864 is formed of a urethane base silverpaint that is sprayed on principal surface 138P of package body 138,sides 1385 of package body 138, and sides 102S of substrate 102 and thencured, e.g., dried.

As set forth above, ground plane 860, e.g., teeth thereof or the entireperiphery of ground plane 860 itself, is exposed at sides 102S ofsubstrate 102. Accordingly, conformal shield 864 contacts ground plane860 at sides 102S of substrate 102. Accordingly, conformal shield 864 iselectrically connected to ground plane 860 and thus held at a referencevoltage, e.g. ground. In other examples, conformal shield 864 isconnected to ground using a shield lid interconnect as described aboveand related structures, e.g., similar to shield lid interconnect 252 ofwireless electronic component package 200 of FIGS. 2, 3 and shield lidinterconnect 452 of wireless electronic component package 400 of FIGS.4, 5, 6 and related structures.

Conformal shield 864 includes a shield lid 866 and shield lid sidewalls868. Shield lid 866 covers the entire principal surface 138P of packagebody 138. Shield lid sidewalls 868 cover the entire sides 138S ofpackage body 138 and sides 102S of substrate 102.

Electronic component package 800 further includes a dielectric shieldisolation layer 870. Shield isolation layer 870 directly contacts,covers, and encloses conformal shield 864 including shield lid 866 andshield lid sidewalls 868.

Shield isolation layer 870 is formed of a dielectric material. Forexample, shield isolation layer 870 is formed of a dielectric materialthat is sprayed on conformal shield 864 including shield lid 866 andshield lid sidewalls 868 and then cured, e.g., dried.

Shield isolation layer 870 includes a shield isolation lid 872 andshield isolation sidewalls 874. Shield isolation lid 872 covers theentire shield lid 866 of conformal shield 864. Shield isolationsidewalls 874 cover the entire shield lid sidewalls 868 of conformalshield 864.

Electronic component package 800 further includes a conformal topfeature layer 876. Conformal top feature layer 876 directly contacts,covers, and encloses shield isolation layer 870.

Conformal top feature layer 876 is formed of an electrically conductivematerial. For example, conformal top feature layer 876 is formed of aurethane base silver paint that is sprayed on shield isolation layer 870and then cured, e.g., dried. The electrically conductive material isthen patterned, e.g., using laser-ablation, to form one or more topfeatures 878 of conformal top feature layer 876. Although a rectangulartop feature 878 is illustrated, in other embodiments, a top feature isformed to have any desired shape, e.g., a spiral, zigzag lines, patches,curves, or other shape.

FIG. 9 is a top plan view of electronic component package 800 of FIG. 8along the line IX illustrating a top feature 878 in accordance with oneembodiment. Referring now to FIGS. 8 and 9 together, top feature 878 isa signal trace in accordance with this embodiment. Top feature 878 isdefined by forming a trench 880 through conformal top feature layer 876entirely around top feature 878. Shield isolation layer 870 is exposedthrough trench 880. Accordingly, top feature 878 is electricallyisolated from the remainder of conformal top feature layer 876.

However, top feature 878 is electrically connected to electricallyconductive embedded interconnects 882, 884 through openings in conformalshield 864 and shield isolation layer 870 as discussed further below. Inaccordance with this embodiment, embedded interconnect 882 is formed onand electrically connected to a first upper trace 116A of the pluralityof upper traces 116. Upper trace 116A is electrically connected to arespective bond pad 112 by a respective bond wire 118. Similarly,embedded interconnect 884 is formed on and electrically connected to asecond upper trace 116B of the plurality of upper traces 116. Uppertrace 116B is electrically connected to a respective interconnectionball 126 by a respective via 122, lower trace 120, and pad 124.

Accordingly, a signal generated by electronic component 104 ispropagated from bond pad 112, to bond wire 118, to upper trace 116A, toembedded interconnect 882, to top feature 878, to embedded interconnect884, to upper trace 116B, to via 122, to interconnection pad 124, and tointerconnection ball 126, and finally to a structure connected tointerconnection ball 126, e.g., to a printed circuit motherboard onwhich electronic component package 800 is mounted.

Conformal shield 864 defines a shielded compartment 886 in whichelectronic component 104 is located. By locating electronic component104 within shielded compartment 886, electronic component 104 isshielded from EMI from top feature 878 by conformal shield 864 and viceversa. Specifically, shield lid 866 of conformal shield 864 prevents EMIfrom passing through principal surface 138P of package body 138 andto/from electronic component 104.

Further, by locating conformal shield 864 close to top feature 878,i.e., only separated by shield isolation layer 870, conformal shield 864acts as a ground plane for top feature 878. The thickness of shieldisolation layer 870 is controlled to provide desired electricalproperties. In this manner, the impedance of top feature 878 iscontrolled, e.g., minimized, as compared to forming a similar topfeature without a ground plane.

Although top feature 878 is set forth as a signal trace in accordancewith this embodiment, in other embodiments, other top features such ascircuit patterns and/or antennas are patterned in conformal top featurelayer 876. Illustratively, a circuit pattern includes a plurality ofsignal traces formed in conformal top feature layer 876.

In another embodiment, top feature 878 is an antenna in conformal topfeature layer 876. In one example where top feature 878 is an antenna,top feature 878 is connected to embedded interconnect 882 only, e.g.,embedded interconnect 884 is not formed. Thus, a signal generated byelectronic component 104 is propagated from bond pad 112, to bond wire118, to upper trace 116A, to embedded interconnect 882, and to topfeature 878, which is an antenna. Illustratively, top feature 878 is anantenna similar to antenna 142 as described above.

As set forth above, embedded interconnects 882, 884 are electricallyconnected to top feature 878 through openings in conformal shield 864and shield isolation layer 870. FIGS. 10, 11, 12, 13 and 14 are enlargedcross-sectional views of the region X of electronic component package800 of FIG. 8 during various stages of formation of the electricalconnection of embedded interconnect 882 to top feature 878 in accordancewith various embodiments.

Although a single connection to top feature 878 is illustrated in FIGS.10, 11, 12, 13 and 14, in light of this disclosure, those of skill inthe art will understand that electrical connection to the other topfeatures of conformal top feature layer 876 are made simultaneously in asimilar manner. For example, the connection between embeddedinterconnect 884 and top feature 878 is made simultaneously and in asimilar manner.

Further, although a wire fence type embedded interconnect 884 isillustrated and discussed below, in other embodiments, embeddedinterconnect 884 is any of the embedded interconnects as describedabove, e.g., is similar to any of the embodiments described above inreference to embedded interconnect 140 of wireless electronic componentpackage 100 of FIG. 1.

Referring now to FIGS. 8 and 10 together, embedded interconnect 882,e.g., a wire fence or wire, is formed. Embedded interconnect 882 isenclosed within package body 138 such that embedded interconnect 882 isexposed at principal surface 138P.

Conformal shield 864 is formed on package body 138 including principalsurface 138P as illustrated in FIG. 10. Referring now to FIGS. 8, 10 and11 together, a conformal shield opening 1188, sometimes called aconformal shield aperture, is formed in conformal shield 864 to exposeembedded interconnect 882.

Referring now to FIGS. 8 and 12 together, shield isolation layer 870 isformed on conformal shield 864 and within conformal shield opening 1188.Referring now to FIGS. 8, 12 and 13 together, a shield isolation layeropening 1390 is formed in shield isolation layer 870 to expose embeddedinterconnect 882.

Shield isolation layer opening 1390 is smaller than conformal shieldopening 1188. Accordingly, a portion of shield isolation layer 870remains on principal surface 138P of package body 138 within conformalshield opening 1188 and adjacent the circumference of conformal shieldopening 1188. Thus, shield isolation layer 870 completely covers andelectrically isolates conformal shield 864.

Referring now to FIGS. 8 and 14 together, conformal top feature layer876 is formed on shield isolation layer 870 and within shield isolationlayer opening 1390 and conformal shield opening 1188. As embeddedinterconnect 882 is exposed through shield isolation layer opening 1390,conformal top feature layer 876 directly contacts and is electricallyconnected to embedded interconnect 882.

Further, conformal top feature layer 876 is electrically isolated fromconformal shield 864 by shield isolation layer 870. Conformal topfeature layer 876 is then pattern, e.g., by laser-ablation, thus formingtop feature 878 within top feature layer 876.

Embedded interconnects 882, 884 are illustrated and discussed above asproviding the connection between upper traces 116A, 116E and top feature878. However, in another embodiment, a trace of substrate 102, e.g., anupper trace 116, a lower trace 120, or an internal trace, is extended toproject horizontally outwards from sides 102S of substrate 102. Thisextended trace extends through corresponding openings in conformalshield 864 and shield isolation layer 870 to connect to a top feature ofconformal top feature layer 876.

Further, although a single shield isolation layer 870 and conformal topfeature layer 876 are illustrated and discussed above, in anotherembodiment, additional shield isolation layers and conformal top featurelayers including top features can be formed as discussed below inreference to FIG. 15.

FIG. 15 is an enlarged cross-sectional view of a region of an electroniccomponent package 1500 illustrating an electrical connection of anembedded interconnect 1582 to a top feature 1578 of a second conformaltop feature layer 1576 in accordance with one embodiment.

Referring now to FIG. 15, conformal shield opening 1188 and shieldisolation layer opening 1390 are formed within conformal shield 864 andshield isolation layer 870 to expose embedded interconnect 1582 in amanner similar to that discussed above.

Conformal top feature layer 876 is formed on shield isolation layer 870and within shield isolation layer opening 1390. A conformal top featurelayer opening 1592 is formed in conformal top feature layer 876 toexpose embedded interconnect 1582. Although conformal top feature layeropening 1592 is illustrated in FIG. 15 as being smaller than shieldisolation layer opening 1390, conformal top feature layer opening 1592is bigger than shield isolation layer opening 1390 in other embodiments.

Second isolation layer 1570 is formed on conformal top feature layer 876and within conformal top feature layer opening 1592. A second isolationlayer opening 1594 is formed in second isolation layer 1570 to exposeembedded interconnect 1582.

Second isolation layer opening 1594 is smaller than conformal topfeature layer opening 1592. Accordingly, a portion of second isolationlayer 1570 remains on principal surface 138P of package body 138 withinconformal top feature layer opening 1592 and adjacent the circumferenceof conformal top feature layer opening 1592. Thus, second isolationlayer 1570 completely covers and electrically isolates conformal topfeature layer 876.

Second conformal top feature layer 1576 is formed on second isolationlayer 1570 and within second isolation layer opening 1594. As embeddedinterconnect 1582 is exposed through second isolation layer opening1594, second conformal top feature layer 1576 directly contacts and iselectrically connected to embedded interconnect 1582. Further, secondconformal top feature layer 1576 is electrically isolated from conformaltop feature layer 876 by second isolation layer 1570. Second conformaltop feature layer 1576 is then pattern, e.g., by laser-ablation, thusforming top feature 1578 within second top feature layer 1576.

FIG. 16 is a cross-sectional view of an electronic component package1600 in accordance with another embodiment. Electronic component package1600 of FIG. 16 is substantially similar to electronic component package800 of FIG. 8 and only the significant differences between electroniccomponent package 1600 and electronic component package 800 arediscussed below.

Referring now to FIG. 16, in accordance with this embodiment, arespective bond pad 112 is connected by a respective bond wire 118 toupper trace 116A. Upper trace 116A is connected to embedded interconnect882. Embedded interconnect 882 is connected to top feature 878. Topfeature 878 is connected to embedded interconnect 884. Embeddedinterconnect 884 is connected to upper trace 116B and to a respectivebond pad 112 by a respective bond wire 118.

FIG. 16 illustrates another specific example of an interconnect usingtop feature 878 extending above electronic component 104. In light ofthis disclosure, those of skill in the art will understand that any oneof a number of interconnects can be formed using one or more topfeatures depending upon the particular application.

The drawings and the forgoing description gave examples of the presentinvention. The scope of the present invention, however, is by no meanslimited by these specific examples. Numerous variations, whetherexplicitly given in the specification or not, such as differences instructure, dimension, and use of material, are possible. The scope ofthe invention is at least as broad as given by the following claims.

1. An electronic component package comprising: a substrate comprising afirst surface; an electronic component mounted to the first surface, theelectronic component comprising a bond pad; a first antenna terminal onthe first surface electrically connected to the bond pad; a secondantenna terminal on the first surface electrically connected to thefirst antenna terminal; a dielectric package body directly contactingand enclosing the electronic component and the first surface, thepackage body comprising a principal surface; an antenna on the principalsurface; and an embedded interconnect extending through the package bodybetween the first surface and the principal surface and electricallyconnecting the second antenna terminal to the antenna.
 2. The electroniccomponent package of claim 1 further comprising: a via aperture in thepackage body, wherein the embedded interconnect comprises anelectrically conductive material filling the via aperture.
 3. Theelectronic component package of claim 2 wherein the via aperture isformed by ablating the package body with a laser.
 4. The electroniccomponent package of claim 1 wherein the antenna comprises conductivematerial applied to the principal surface.
 5. The electronic componentpackage of claim 4 wherein the conductive material compriseselectrically conductive paint that has been cured.
 6. The electroniccomponent package of claim 1 further comprising a shielding structureshielding the electronic component.
 7. The electronic component packageof claim 6 wherein the shielding structure comprises a shield lid formeddirectly on and covering a portion of the principal surface directlyabove the electronic component.
 8. The electronic component package ofclaim 7 wherein the package body further comprises sides, the shieldingstructure further comprising shield lid sidewalls formed directly on andcovering portions of the sides adjacent the electronic component.
 9. Theelectronic component package of claim 8 wherein the shield lid andshield lid sidewalls are formed of an electrically conductive materialapplied to the portion of the principal surface directly above theelectronic component and to the portions of the sides adjacent theelectronic component.
 10. The electronic component package of claim 8wherein the substrate further comprises sides, the shield lid sidewallsformed directly on and covering portions of the sides of the substrateadjacent the electronic component.
 11. The electronic component packageof claim 7 further comprising: a shield trace on the first surface ofthe substrate, wherein the shielding structure further comprises ashield lid interconnect extending from the shield trace to the shieldlid through the package body and electrically connecting the shieldtrace to the shield lid.
 12. The electronic component package of claim11 wherein the shield lid interconnect comprises one or more wires. 13.The electronic component package of claim 6 wherein the shieldingstructure comprises a metal can enclosed in the package body.
 14. Anelectronic component package comprising: a substrate comprising a firstsurface; an electronic component mounted to the first surface, theelectronic component comprising a bond pad; a first trace on the firstsurface electrically connected to the bond pad; a package body directlycontacting and enclosing the electronic component and the first surface,the package body comprising a principal surface; an electricallyconductive conformal shield on the package body; a shield isolationlayer on the conformal shield; a conformal top feature layer on theshield isolation layer; and an embedded interconnect extending throughthe package body between the first surface and the principal surface andelectrically connecting the first trace to the conformal top featurelayer.
 15. The electronic component package of claim 14 wherein theconformal shield comprises a conformal shield opening and wherein theshield isolation layer comprises a shield isolation layer opening, theembedded interconnect being exposed through the conformal shield openingand the shield isolation layer opening.
 16. The electronic componentpackage of claim 15 wherein the conformal top feature layer is formedwithin the shield isolation layer opening and the conformal shieldopening to directly contact and be electrically connected to theembedded interconnect.
 17. The electronic component package of claim 14wherein the conformal shield is electrically connected to a ground planeof the substrate.
 18. The electronic component package of claim 17wherein the conformal top feature layer comprises a top featureconnected to the embedded interconnect.
 19. The electronic componentpackage of claim 18 wherein the top feature is selected from the groupconsisting of a trace and an antenna.
 20. A method of forming anelectronic component package comprising: mounting an electroniccomponent to a first surface of a substrate; electrically connecting abond pad of the electronic component to a first trace on the firstsurface; directly contacting and enclosing the electronic component andthe first surface in a package body, the package body comprising aprincipal surface; forming an electrically conductive conformal shieldon the package body; forming a shield isolation layer on the conformalshield; forming a conformal top feature layer on the shield isolationlayer; and electrically connecting the first trace to the conformal topfeature layer with an embedded interconnect extending through thepackage body between the first surface and the principal surface.